Conference / Phoenix, United States
✓ Verified event23rd Annual IMAPS Device Packaging Conference 2027
An international microelectronics assembly and packaging conference for technical and business professionals. The program covers advanced device packaging and related semiconductor manufacturing technologies that support AI and machine-learning computing infrastructure.
Topics
- advanced packaging
- AI infrastructure
- microelectronics
- semiconductor manufacturing
Details may change. Confirm the programme, availability and registration with the organizer.
Visit the official event site ↗- Dates
- 1 March 2027 – 4 March 2027
- Duration
- 4 days
- Starts
- In 145 days
- Place
- Phoenix, United States
- Venue
- Sheraton Grand at Wild Horse Pass
- Format
- In person
- Language
- English
- Organizer
- International Microelectronics Assembly and Packaging Society
- Last verified